Title: DETD Packaging TD Engr - TF Dep Location: USA-Arizona, Phoenix Job Number: 711387 The successful candidate would be expected to develop equipment and process technology for next generation thin film deposition for HDI (high density interconnect) substrate manufacturing. She/he will evaluate, develop and select equipment capable of meeting quality, reliability, cost, yield, productivity and manufacturability requirements. She/he will need to have the ability to work with a diverse team to identify and address technical challenges.
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